Wafer polishing machine is a new type of semiconductor wafer polishing equipment which is economical, practical and easy to realize. Wafers are commonly found in various integrated circuit boards, chips. Wafers need to go through slicing, grinding, polishing and other processes before forming. As the wafer size is getting smaller and smaller, the requirements of grinding and polishing technology are getting higher and higher, and the traditional grinding method can not meet the technological requirements.

Wafer polishing machine equipment is mainly composed of rotating head, indenter, polishing pad, grinding table and other parts. The replaceable indenter is mounted under the rotating head, and its combined effect is to clamp the wafer and ensure that the wafer does not shift during rapid rotational polishing; The polishing pad is also a soft replaceable material mounted above the grinding table. As the name suggests, its role is to hold the wafer screen and perform the polishing function. When the machine is running, the wafer is placed between the polishing pad and the indenter, and then diamond polycrystalline lapping liquid and polishing liquid are added to lubricate and polish the wafer.

The working process is roughly as follows: first, the positive and negative sides of the wafer can be polished at the same time; Two, the edge part can be local mirror polishing. Third, the front and back of the mirror polishing again, small wafer only need to do the front mirror polishing. Wafers are made up of polysilicon and monocrystalline silicon, which are relatively hard and small in size. It needs to be polished several times before it becomes qualified. Wafer polishing machine plays an irreplaceable role in the process of wafer polishing. The invention reasonably avoids problems such as excessive polishing of the edge area of the semiconductor wafer or failure of mirror polishing, and can completely remove the ring oxide layer after polishing.

Is wafer polishing really that good? Let's look at the chip related news: since last year, the global chip shortage, chip demand has reached a very good height. With the development of integrated circuit manufacturing technology, the number of finished interconnect layers of chips is increasing, and the manufacturing process is getting higher and higher. Meanwhile, the surface of multi-layer wiring wafer must have extremely high smoothness, smoothness and cleanliness. This also puts forward higher requirements for polishing technology of wafer production.